ISO 9001:2015 Certified - Fabless Semiconductor ASIC Design Company - Montreal, Canada
Portfolio
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High-density X-ray image sensor
- 2D stitching
- 8192x8192 array size
- 7 um x 7 um element size
- Measure charge or photon input
- Tileable array for larger panel
- 90nm CMOS technology
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48x16 ultrasound pico-probe
- 768 Tx / Rx drive elements for MEMS piezo array
- 150 um x 200 um element size
- Embedded 10ns resolution / 128 steps Tx/Rx delays in each element 100V Tx driver voltage
- Embedded voltage regulators for core power rails
- 8B10B interface for Host communication
- 0.18um CMOS Technology
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Medical Muscle Stimulation Device
- Single lithium-ion or silver oxide battery power supply
- Embedded 100V DC-DC converter for excitation full bridge driver
- I2C control interface
- Programmable stimulation current with controlled ramp-up / ramp-down time
- Real-time current / voltage monitoring for fine stimulation adjustment
- Real-time overvoltage and over-current protections
- OTP memory to hold system configuration options and calibration parameters
- 0.35um HV CMOS Technology
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Temperature Measurement IC
- High-sensitivity calibrated temperature measurement
- Sigma-Delta ADCs
- I2C interface
- Direct battery connection with embedded voltage regulators for core/IO power supply
- Embedded LED/LCD drivers
- Embedded buzzer driver
- Capacitive proximity sensor
- 0.18um CMOS Technology
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3-Axis Magnetic Camera
- 128x128 pixels with X, Y and Z hall-effect sensors
- Pixel size 100um x 100um
- Sensitivity from +/-5mT to +/-80mT
- Parallel 12-bit ADC conversion
- Fast SPI readout/control interface
- 0.18um CMOS Technology
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High Speed Magnetic Angle Sensor
- Detects direction of magnetic field parallel to IC surface
- Maximum Rotation speed 200k RPM
- 12-bit rotation resolution
- SPI interface
- A quad B & UVW interface
- 0.35um HV CMOS technology
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CMOS image sensor
- 1D stitching
- 26x35mm die size
- 1936x1460 pixel matrix
- 4T pinned photodiode APS
- Voltage mode Analog Output
- 18um square pixels
- >78% fill factor
- High Full Well – 800ke-
- Read noise <100e-
- 0.18um CMOS technology
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Wafer Scale X-ray Readout ASIC
- 2D stitching
- 148x115mm die size
- Manufactured on 8” wafers, with only one die per wafer
- 2908x2304 pixel matrix
- Measure charges collected by a matrix of electrodes under a direct conversion layer
- 2304x 16 bits ADC
- Readout speed 30 frames per second
- 0.35um HV CMOS Technology
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High Voltage Gate Driver
- Programmable gate drive voltage (+22/-6V Max)
- Temperature Monitoring
- High Voltage Monitoring
- UART Communication
- Over current protection
- 0.35um HV CMOS Technology
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3D Hall Magnetic Sensor
- 3 Axes magnetic sensor (2 vertical, 1 horizontal)
- 3 Analog processing channels
- Built-in temperature sensor
- Selectable gain setting
- SPI interface for communication
- 0.35um HV CMOS Technology
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Charge Measuring ASIC
- 5 Channels low noise amplifier
- Programmable gain
- Programmable gain low pass & high pass filter to optimize signal performance
- 15bit delta sigma ADC at 1ksps
- I2C interface
- FIFO memory
- Power management with ultra low power mode
- Temperature sensor
- 0.18um technology
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64-channel Mems controller IC
- Embedded flash and SRAM memory (JTAG programming)
- 64 PWM channels with 10-bit resolution and calibration features
- SPI configuration interface with safety features
- 0.18um high-voltage process
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Readout IC with embedded 512 pixel line
- Low noise ( 10 e- rms noise at 200 Ke- full scale )
- 512 channels with embedded photodiode and 16-bit ADC
- 39 um pitch
- Low power (0.5 mW / channel)
- Simple interface allowing control / readout of 16 devices through only 3 LVDS ports and an I2C interface.
- Short readout cycle (333us)
- Medical application ASIC
- 0.35um opto technology
- 20 mm x 1.45 mm die size
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Proximity Sensor
- On die photo diode
- Ambient Light immunity (up to 25K lux; spectrum equivalent to 5780K Black Body Radiator)
- Operate with pulse train excitation waveform
- 100mA Maximum LED Driver Current
- Embedded EEPROM for Temperature Calibration
- 0.6um high voltage technology
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Stud detector, AC detector and Metal detector
- 3 Stud detectors with 16bit Delta sigma converter
- AC detector with high gain amplifier and high Q bandpass switch capacitor
- Metal detector with 12bit control DAC
- I2C interface for communication
- 0.18um technology
- 0.8mm x 1.4mm die size
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Rectifier Bridge IC
- 60V Operation
- Intelligent control of the switching devices
- Chip Scale Packaging (CSP)
- 0.18um high voltage technology
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HV Power Converter
- 400V Operation
- DC-DC Converter
- Chip Scale Packaging (CSP)
- 1.0um 650V CMOS Technology
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Opto Encoder
- Built-in photo diode for Encoder application
- Dual 11bit M code scanning
- Sine/Cosine analog track
- Quadrature signals with 12bit CPR
- Photodiodes amplitude/offset adjust
- 7bit LED driver
- 0.35um technology
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Optical Receiver ASIC
- Monolithic CMOS optical receiver
- Ambient light immunity 200klux
- Incandescent light immunity
- Sensitivity (λ=800-1000nm) 3.2uW- 320uW
- 0.6um high voltage technology
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Low Power Touch Screen ASIC
- Embedded standard microcontroller (16kbyte ROM, 4kbytes SRAM, 4kbytes NVRAM, RS-232 Interface, I2C, Timer, Watchdog timer)
- 30 excitation drivers
- 20 input channels with charge amplifiers, filter and 12bit ADC
- Multiple frequency scanning
- DC-DC Converter (3.3V to 14.5V)
- Handheld display application
- 0.18um high voltage technology
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Inductive Step-Down Converter
- Up to 1.2A output current
- High efficiency (up to 95%)
- Wide input voltage range
- Internal 60V NDMOS switch
- Built-in soft start capability
- Low power shutdown
- Up to 2MHz switching frequency
- 0.6um high voltage technology
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Capacitive Touch Screen ASIC
- Embedded standard microcontroller (2kbyte ROM, 2kbytes SRAM, 10kbytes EEPROM, RS-232 Interface, SPI, I2C, Timer, Watchdog timer)
- 15 excitation channels
- 10 input channels with charge amplifiers, filter and 12bit ADC
- Multiple frequency scanning
- Handheld display application
- 0.35um high voltage technology
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Phase Shift Encoder ASIC
- Electric encoder ASIC with Binary, Decimal and Natural modes, up to 17280 steps / rotation cycle at 6000 RPM
- Internal excitation waveform generation
- I2C interface to download calibration / configuration data at start-up from external EEPROM
- Master / slave GmC filters
- 0.35um technology
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Capacitive Sensor Frontend ASIC
- SPI interface
- UART interface
- ADC - Delta Sigma 16 bit
- Switchcap notch filter 50/60 Hz
- Switchcap lowpass filter 4th order
- Internal regulator 3.3V
- Biometric application
- 0.35um high voltage technology
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CMOS Parallel-To-Serial FIFO
- 50MHz serial port shift rate
- 4096x9 DPRAM
- Serial communications applications, tape/disk controllers, and LANs
- 9-bit parallel input port and serial output port
- 0.6um technology
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Photon Counter / Integrator
- Ultra low noise (100e- RMS)
- 1024 Channels
- Low power (0.6mW/Channel)
- 2x 14-bit counters per channel
- 18-bit ADC per channel
- Medical device
- Chip scale packaging (CSP)
- 0.35um high voltage technology
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CT-Scan Front-End IC
- Low noise (4nV/v(Hz) )
- 64 Channels with 18bit ADC per channel
- Low power (2mW/Channel)
- 300us conversion time
- High speed LVDS interface
- Custom fpBGA package
- Medical device
- 0.6um high voltage technology
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High Speed Bidirectional FIFO
- 2048x9 bit Dual-Port RAM
- Military applications
- Registered and transparent bypass modes
- TTL Compatible
- 0.6um high voltage technology
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MEMS Controller
- 64-bit OTP
- SPI interface
- 54 pairs of low Rds on switches
- 0.8um high voltage technology
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Medical Data Acquisition ASIC
- Embedded standard microcontroller (3 RS-232 interface, SPI interface, 1kbyte ROM, 2kbytes SRAM, 16kbytes FLASH, Watchdog timer)
- Dual channel ECG amplifier
- Touch detect sensor
- Low Power
- Battery driven ASIC
- 0.6um high voltage technology
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Telephony IC
- Adaptable to any digital communication protocols
- 4 Delta-Sigma Codec, A-law/µ-Law
- High voltage (15V)
- Multiple VCA, AGC
- Switch capacitor filter
- Digital filter (DSP)
- FD digital/analog interface
- TDMA interface
- Telephony applications ASIC
- 0.8um high voltage technology
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CT-Scan Readout IC
- Low noise ( 4 nV/v(Hz) )
- 24 channels
- Low power (20 mW / channel)
- Medical application ASIC
- 0.6um high voltage technology
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Level Detector IC
- High speed comparators
- High resolution timing
- Offset free
- Low power
- 11 bits current D/A converter
- Battery driven ASIC
- 0.6um technology
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Stud/Metal/AC Detector IC
- Embedded standard microcontroller (RS-232 interface, 4 kbytes ROM, 1 kbyte SRAM)
- Density detector
- Metal Detector
- AC signal detector
- Built-in multi-segment LCD/LED driver
- Battery driven ASIC
- 0.6um technology
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Touch Screen Front-End IC
- High-Voltage ASIC (-35 V to +5 V)
- Very low noise ( 4 nV/v(Hz) )
- 16 inputs, 12-bit ADC, 50 KHz sampling
- Switch-cap filter
- Integrated step-up inverter DC/DC controller
- 0.8um high voltage technology
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AC/DC Power Supply Controller
- High-Voltage ASIC (18V)
- Dual current-mode PWM control channels
- 32-bit OTP for control & calibration
- Very low standby power
- Spread spectrum oscillator
- Security features
- 0.8um high voltage technology
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Density/AC Detector
- Density detector
- AC signal detector
- Battery driven ASIC
- Built-in multi-segment LCD/LED driver
- 0.6um technology
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Linear & Rotary Encoder
- Embedded standard microcontroller (2x RS-232 interface, I2C interface, 2x 16-bit timers)
- 4x 8-bit PROM
- 8x 11-bits ADC
- Error < 0.1% per electrical revolution
- AGC for excitation signal
- Low Noise charge amplifier
- 4th order bandpass filter
- 4th order lowpass filter
- 0.35um technology
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Optoelectronics LED Drivers
- 64 channel
- Current drive 30mA per channel
- High speed application ASIC (5ns from 0 to full scale)
- 4 x 8bits D/A converters
- Embedded SRAM
- High Accuracy (+/- 2% of nominal current)
- High Power IC (5W)
- 0.6um technology
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Readout IC
- Low noise ( 3.5 nV/v(Hz) )
- 132 channels
- Low power (5 mW / channel)
- Integrated 16 bits A/D converter / channel
- Short readout cycle (6us)
- Medical application ASIC
- 0.6um high voltage technology
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High Voltage Interface ASIC
- Simulator user interface application
- High voltage IC (40V)
- Multiple power planes (-12V,0V, 5V, 12V & 28V)
- 12 bits A/D & D/A converters
- SPI & ARINC 429 interfaces
- High power MOSFET drivers with over current protection
- 0.8um high voltage technology
Frequently Asked Questions
Comport Data’s ASIC portfolio showcases over three decades of completed custom integrated circuit projects across a wide range of industries and technologies. The portfolio includes readout ICs, optoelectronic LED drivers, medical data acquisition ASICs, encoders, CT-scan front-end ICs, touch screen controllers, power converters, image sensors, magnetic sensors, ultrasound probes, and many more, each representing a real product delivered to a customer.
Comport Data’s portfolio spans multiple industries, including:
- Medical: CT-scan readout ICs, X-ray image sensors, ECG amplifiers, muscle stimulation devices, photon counters, and wafer-scale X-ray readout ASICs
- Industrial: Rotary and linear encoders, MEMS controllers, power converters, stud/metal/AC detectors
- Consumer Electronics: Touch screen controllers, proximity sensors, capacitive sensor front-ends
- Telecommunications: Telephony ICs with delta-sigma CODECs
- Defense/Military: High-speed bidirectional FIFOs for military applications
- Optoelectronics: LED drivers, optical receivers, opto-encoders, CMOS image sensors
Among the most technically demanding projects in the portfolio are the Wafer-Scale X-ray Readout ASIC (148x115mm die, 2D-stitched, 2908×2304 pixel matrix on 8-inch wafers) and the High-Density X-ray Image Sensor (8192×8192 array, 7µm element size, 90nm CMOS technology). These represent the cutting edge of large-format medical imaging IC design.
Yes. Comport Data has extensive experience designing ASICs specifically for CT-scan imaging systems. Portfolio entries include a CT-Scan Readout IC (24 channels, 4 nV/√Hz noise, 0.6µm HV technology) and a CT-Scan Front-End IC (64 channels, 18-bit ADC per channel, 2mW/channel, high-speed LVDS interface, custom fpBGA package), both of which are medical-grade devices optimized for low noise and low power.
Comport Data’s portfolio spans a broad range of process nodes, including 1.0µm, 0.8µm, 0.6µm, 0.35µm, 0.18µm, and 90nm CMOS and high-voltage CMOS technologies. The selection of process node is always driven by the performance, voltage, power, and die-size requirements of each specific project.
Yes. The portfolio includes multiple image sensor ASICs, including a CMOS Image Sensor (1936×1460 pixels, 4T pinned photodiode, 1D-stitched, 0.18µm), a Wafer-Scale X-ray Readout ASIC (2908×2304 pixels, 2D-stitched, 0.35µm HV CMOS), and a High-Density X-ray Image Sensor (8192×8192 array, 7µm elements, 90nm CMOS). These projects demonstrate Comport Data’s capabilities in large-format, high-resolution imaging IC design.
Yes. Comport Data’s portfolio page provides an overview of completed ASIC projects, including key specifications for each design. While proprietary details are kept confidential, the portfolio gives prospective customers a clear picture of the company’s technical depth and range of application experience. For a more detailed discussion relevant to your specific application, you can contact Comport Data directly.
Yes. The portfolio includes a 48×16 Ultrasound Pico-Probe ASIC featuring 768 Tx/Rx drive elements for MEMS piezo arrays, with embedded 10ns resolution delays, 100V Tx driver voltage, embedded voltage regulators, and an 8B10B interface for host communication, fabricated in 0.18µm CMOS technology.