CDI12100
CDI64500
CDI64600
Why Choose Comport Data ASICs
Multi-channel Readout Expertise
Decades of experience in designing high-density readout electronics for complex sensor arrays.
Low-noise, High-performance
Precision analog and mixed-signal designs optimized for the most demanding SNR requirements.
Flexible Volume
We support your growth from low-volume prototypes to high-volume production chips.
End-to-End Capabilities
Complete support from initial specification to wafer probing and final package testing.
Explore Our ASIC Portfolio
Our ASIC products are part of a wider portfolio of mixed-signal and custom IC designs developed for demanding applications in medical imaging, sensing, industrial systems, and high-voltage electronics. To see more examples of our engineering capabilities, explore our full ASIC portfolio.
View ASIC PortfolioReady to Discuss Your ASIC Requirements?
Our engineers are available to provide technical consultations, datasheets, and volume pricing.
Frequently Asked Questions
We offer a portfolio of proprietary mixed-signal ASIC products designed for advanced signal-processing applications in commercial, industrial, and medical markets. Our product range includes multi-channel readout ICs, sensor analog front-end (AFE) circuits, and high-precision current-to-digital ADC converters, many of which are specifically engineered for X-ray scanner and CT-scan imaging systems.
Our current catalog of available ASIC products includes:
- CDI12100 – 12-Channel Sensor Analog Front-End ASIC
- CDI64500 – 64-Channel, 18-Bit Current-to-Digital ADC
- CDI64600 – 64-Channel, 16-Bit Current-to-Digital ADC
Each product is available as a packaged chip or diced wafer in low or high volumes.
The primary application focus for our ASIC product portfolio is medical imaging, specifically X-ray scanners and CT-scan systems. However, the products’ high-precision, low-power, multi-channel signal-processing architectures also make them well-suited for industrial sensor systems, scientific instrumentation, and other applications requiring accurate conversion of small analog signals.
Yes. We can supply our ASIC products in both low volume (suitable for prototype, evaluation, and small-series production) and high volume (for large-scale production runs). Products can be delivered as packaged chips or as diced wafers, giving customers flexibility in their integration approach.
Yes. In addition to packaged chips, our ASIC products can be supplied as diced wafers (bare die). This option is useful for customers performing multi-chip module (MCM) assembly, chip-on-board (COB) integration, or other applications where packaged devices are not preferred.
Pricing, configuration options, and availability for all our ASIC products are available upon request. You can contact our team directly through the contact page on our website to discuss your volume requirements and receive a quotation.
Yes. Alongside our catalog of standard ASIC products (CDI12100, CDI64500, CDI64600), we also offer fully custom ASIC design services. This means customers can commission a bespoke IC designed to their exact specifications, and we manage the full process from concept to silicon.