ASIC Testing

Comport Data provides end-to-end ASIC testing services covering the entire production lifecycle, from pre-production characterization runs through to high-volume production testing. Services include wafer-level probing, packaged chip testing, temperature testing, failure analysis, and test program development or migration for both new and existing products.

Yes. Comport Data has in-house wafer-probing capabilities using Electroglass wafer probers that support both 6-inch and 8-inch wafer formats, equipped with a hot chuck system and an inker for die marking. This allows wafer-level electrical verification of ASIC dies before packaging, reducing downstream packaging costs for non-conforming die.

Comport Data can test chips in most popular package formats using in-house Exatron multi-site handlers. These handlers support a wide variety of surface-mount (SMD) and dual in-line (DIL) package types, enabling automated high-throughput production testing.

Yes. Comport Data has a TestEquity temperature chamber capable of programmable fast-cycling temperature testing across the full military temperature range. This enables characterization and production screening of ASICs for operation in demanding environments requiring high reliability over wide temperature ranges.

Comport Data uses custom-made mixed-signal testers that were specifically designed and built in-house to interface directly with their wafer probers and both SMD and DIL package handlers. This bespoke approach ensures that the test systems are optimally matched to the electrical characteristics of the mixed-signal ASICs being tested.

For failure analysis, Comport Data uses a combination of in-house and external resources:

• In-house: Analytical probing using a Wentworth Labs probing station with a Bausch & Lomb Micro-zoom microscope, and Liquid Crystal thermal analysis for electrical fault detection.
• External: Focused Ion Beam (FIB) analysis for multi-layered IC structure modification and inspection, Electrostatic Discharge (ESD) verification, and Photon Emission Microscopy (PEM) for latchup detection.

Yes. ESD verification is available as part of Comport Data’s failure analysis and quality assurance offering. External resources are used to perform ESD characterization and compliance testing to ensure that ASICs meet the required robustness standards for their intended application.

Yes. In addition to testing ASICs developed by Comport Data, the company can also develop new test programs from scratch or migrate existing test programs for products that were originally designed elsewhere. This service is useful for customers who need to re-qualify a product, change test equipment, or bring testing in-house.

Yes. Comport Data has baking equipment for moisture removal per the JEDEC J-STD-033 standard. This is a critical pre-conditioning step for packaged ICs to prevent moisture-induced failures (popcorning) during reflow soldering, ensuring that test results accurately reflect the performance of properly conditioned devices.

Yes. Comport Data supports the full testing ramp from pre-production characterization runs (typically used for engineering validation and test program development) through to high-volume production testing. The multi-site handler infrastructure and custom tester platforms are designed to deliver the throughput required for cost-effective high-volume testing.