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In-House Characterization and Production Testing Equipment: 
- Testers: Mixed signal custom-made testers,
designed and built for interfacing to Wafer probers and SMD & DIL
handlers.
- Wafer Probers: Electroglass 6" &
8" wafers with hot chuck system and inker.
- Handlers: Multi-sites Exatron handlers for
testing of most popular packages.
- Temperature Testing: TestEquity temperature
chamber programmable for fast-cycling full military range temperature
testing.
- Analytical Probers: Wentworth Labs probing
station with Bausch & Lomb Micro-zoom microscope.
- Baking equipment for moisture removal per
JEDEC J-STD-033.
- Miscellaneous: Electrical fault detection
using Liquid Crystal thermal analysis.
External
resources used for failure analysis:

- Focused Ion Beam (FIB) system for modifying
and analyzing multi-layered IC structures
- Electrostatic Discharge verification (ESD)
- Photon emission microscopy (PEM) for latchup
detection.
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